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author: Ju-Young Kim

1 Articles are founded.

Research Progress in Flexible and Stretchable Encapsulation Materials for Electronics
유연 및 신축 전자소자용 봉지막 재료의 연구 동향
J. Flex. Print. Electron. 2025;4(1):15-30.
https://doi.org/10.56767/jfpe.2025.4.1.15
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June, 2026
Vol. 5, No. 1

eISSN:2951-2174





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