Journal of Flexible and Printed Electronics
Korea Flexible & Printed Electronics Society
Research Article

Localized Black Polyimide Absorbers for Low-Reflectance Ag Metal Mesh Electrodes

Ji-Sub Park1,2, Jun-Young Jeon1,2, Hak-Rin Kim1,2,3,*, Jun-Chan Choi4,**
1School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Korea.
2XR Display Industry-Academia Research Institute, Kyungpook National University, Daegu 41566, Korea.
3School of Electronics Engineering, Kyungpook National University, Daegu 41566, Korea.
4School of Electrical Engineering, Pukyong National University, Busan 48513, Korea.
*Corresponding Author: Hak-Rin Kim, School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Korea, Republic of. E-mail: rineey@knu.ac.kr.
**Corresponding Author: Jun-Chan Choi, School of Electrical Engineering, Pukyong National University, Busan 48513, Korea, Republic of. E-mail: jcchoi@pknu.ac.kr.

© Copyright 2026 Korea Flexible & Printed Electronics Society. This is an Open-Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/4.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.

Received: May 09, 2026; Revised: Jun 09, 2026; Accepted: Jun 12, 2026

Published Online: Jun 24, 2026

Abstract

Flexible transparent conducting electrodes based on metal mesh structures can achieve low sheet resistance but often exhibit visible reflection from the metallic lines. Here, we introduce a localized black polyimide (BPI) light absorption layer near the Ag mesh lines to reduce metal-induced reflection while preserving the essential electrode characteristics. The BPI layer, consisting of carbon-black-dispersed polyimide, was patterned by combining thermal imprinting with Ag nanoparticle ink filling, thermal treatment, and selective etching, thereby localizing the light-absorption layer near the Ag mesh lines. At 550 nm, the localized BPI layer reduced the reflectance of the Ag electrode region from 50.22% to 4.94%, corresponding to a 90.16% reduction. Because the BPI layer was selectively self-positioned at the reflective metal-line region, this local reduction in reflectance provides a structural route to reducing the visibility of metal mesh electrodes. The fabricated electrode maintained transparent-electrode characteristics, with only a limited change in sheet resistance after selective etching and repeated bending.

Keywords: Transparent electrode; Metal mesh; Light absorption layer; Flexible electronics