Table 2. Printing technique comparison for graphene interconnects in terms of ink rheology, resolution, film thickness, conductivity, throughput and application suitability.

Technique	Viscosity Window	Resolution	Thickness per Pass	Reported conductivity	Throughput	Best-fit application	Ref
Inkjet printing	1–30 mPa·s	20–50 µm	<200 nm	3.91×104 S/m	Moderate (digital)	Digital prototyping and complex multi-layered layouts	[13, 17]
Aerosol jet (AJP)	1–1,000 mPa·s	5–20 µm	100–700 nm	~5×104 S/m	Moderate (digital)	Conformal printing on 3D/curved surfaces and fine-pitch die routing	[20, 44, 51]
Screen printing	1–10 Pa·s	40–100 µm	5–25 µm	8.81×104 S/m	High (roll-to-roll)	Power buses, ground planes, and high-volume manufacturing	[55, 57]
Gravure printing	50–200 mPa·s	~30 µm	15–30 nm	~1×104 S/m	Very High (up to 15 m/s)	Large-area, industrial-scale high-speed production	[32, 44]
EHD printing	≤500 mPa·s	1–10 µm	Nanoscale	35±6 Ω/sq (sheet Res.)	Low (high-res focus)	Micro-VIAs, ultra-thin chip integration, and nanoelectronics	[3, 42]

Note: The values listed are representative ranges reported for graphene-based printed interconnects and may vary depending on ink formulation, substrate, post-treatment and printing parameters.